BankTech Asia 2018

Returning to Kuala Lumpur for its 10th year, BankTech Asia Kuala Lumpur 2018 received close to 300 guests, consisting of local and foreign senior level bankers, over 200 trade visitors and 40 exhibitors. Held on the 24th and 25th of July 2018, the two-day event also held conferences featuring more than 35 experts, focusing on Retail Banking, Payments & Transactions and Technology Risk Management.

As one of the exhibitors, HeiTech Padu Berhad, via HeiTech Managed Services Sdn. Bhd. showcased its latest offerings. The main highlights at the HeiTech booth were the SMART DC and the Branch-In-A-Bag. Also showcased during BankTech Asia Kuala Lumpur 2018 was SOC, a Secure-X offering and RE.CON, a new core banking software solution from HeiTech i-Solutions.

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